Packaging Engineer

Overview   Microsoft’s Quantum Systems organization is a multidisciplinary organization advancing cutting-edge quantum technologies to address some of the world’s most complex challenges. We are seeking a  Packaging Engineer  with a focus on mechanical simulation.  This is a unique opportunity to shape the future of quantum systems in a dynamic, mission-driven environment.      At Microsoft Quantum, we aim to empower science and scientists to solve the world’s biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology.   Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. For more information about our team, visit   https://www.microsoft.com/en-us/quantum .         Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.     We are looking for a  Packaging Engineer  with a focus on mechanical simulation. Responsibilities will include adapting industry standard packaging processes and materials to the unique requirements of quantum devices. You will be working with a diverse team of engineers and scientists on assembling and scaling complex quantum hardware devices. To be successful, you will actively work with our globally distributed team to establish common, robust assembly processes and materials.

T hermal, structural, and thermo-mechanical simulations  for quantum packaging hardware, including substrates, interposers, chip attach, cryogenic fridge components, and supporting cryogenic structures.    Develop simulations that span  hand calculations, reduced-order models, and full finite-element analysis (FEA)  depending on fidelity and program needs.    Structural and thermo-mechanical simulations  to assess CTE mismatch, interfacial stress, warpage, and deformation across thermal cycles.   packaging reliability assessments , including risks associated with flip-chip attach, solder joints, substrate bonding, and PCB interfaces.   Generate and maintain  reusable simulation templates, material libraries, and modeling workflows  to improve consistency and efficiency across the packaging team.    Work in teams or independently as required.   Embody our  Culture  and  Values Qualifications   Required/Minimum Qualifications  Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience OR equivalent experience  Other Requirements  Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screening Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.  Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C.