Process Engineer – Advanced Semiconductor Packaging

Keysight  is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more  about what we do.   Our award-winning   culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.   Established over 50 years ago,  Keysight’s HFTC  provides semiconductors that drive Keysight's market leadership and revenue. Located in the beautiful wine country of Sonoma County in Santa Rosa, California, HFTC is a world-class semiconductor organization that invents, designs, and manufactures state-of-the-art custom integrated circuits (ICs) to enable the industry’s highest-performance test and measurement solutions. HFTC’s proprietary indium phosphide (InP) and gallium arsenide (GaAs) semiconductor platforms make possible some of the world’s highest-speed and highest-frequency Monolithic Microwave Integrated Circuits (MMICs). These chips are custom designed to enable instrumentation with unmatched signal fidelity, bandwidth, and dynamic range. Keysight’s 50,000 sq. ft. microfabrication facility—paired with deep expertise in IC design, modeling, and advanced compound semiconductor manufacturing—provides a distinct competitive advantage in delivering industry-leading performance.

We focus on process research and development, process integration, and New Product Introduction.  You will lead the development of next-generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.   Responsibilities may include: Develop and maintain wafer fabrication processes Develop and maintain package assembly processes Specify, select and qualify new equipment Contribute to process automation Review new designs for manufacturability and provide feedback to module designers Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams Meet accelerated project schedules; communicate and manage risks Develop and maintain high yields while adhering to project schedules   Qualifications   BS or MS or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 5+ years of applicable experience in s emiconductor fabrication/advanced packaging processes.   We are seeking an industry professional with proven expertise in three or more of the following areas: Design for manufacturing of electromechanical assemblies Statistical process control (SPC), design of experiments (DOE) Thermocompression / flip chip bonding Surface Mount Technology (SMT) processes Die singulation Semiconductor fabrication processes Heterogeneous integration, advanced packaging techniques New technology introduction New product introduction Professional experience in the following areas is desired: III-V compound semiconductors and/or silicon technologies Thermal, mechanical and electrical reliability Technical project management, project lifecycle This role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in the AI market. Excellent interpersonal and communication skills are important for successful cross-functional interactions.   Candidates must be local or willing to