MEOS - Module Engineer On Shift

Job Description: Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

Prioritize and organize daily activities around multiple requests for engineering DOEs, pre-ops meeting preparation, documentation and AR tracking, and quick and effective response to production issues. Be experts in all tools and processes in the area to support elaborate DOEs and NPIs. Be able to coach and role model the correct execution of module operations. Clearly understand and communicate execution issues, quality excursions, and equipment problems to Engineering and Manufacturing teams. Apply correctly and effectively the POR tools and methods to contain, mitigate and solve issues, including: XTREAMs and Spec RFCs, Wiki / Documented BKMs / MITTS records / Tool error and troubleshooting message, 5M+E checklists, Tool log files / SC logs / SPC++ / E3 / ATRMS / Feedback files, MBPS (is/is-not, models, validation data). Escalations or pass down must include full documentation of steps and results obtained to that point, plus any next steps or recommendations. Ensure all Out-of-Control events have been annotated, reviewed and issues communicated for resolution First point of contact for Manufacturing. Spend more than 3/4 of your time on the floor. Disposition/release un-scheduled hold lots within 10 hours and scheduled hold lots within 24 hours. Support Manufacturing on resolving any product recipe or parameter issues. Keep all Operation and Recipe Creation specs up to date. Initiate the investigation and documentation of quality excursions for the area, in partnership with Manufacturing and Factory Quality teams. Assume initial ownership where RC is not evident. Prepare and execute New Product Introductions, including evaluation of recipe needs, collateral ordering, and recipe creation. Understand and ensure all data is collected on critical lots. Consolidate and prioritize area improvement projects with Manufacturing Support Working Group and Task Force activities, executing experiments and providing engineering data. Support MTEs on resolving any equipment issue. Complete clear pass downs for issues seen and resolutions found. Support early processing of lots through new operations, then provide training, certification and final endorsement to Manufacturing. The candidate should exhibit the following behavioral traits: Strong technical problem-solving abilities with the ability to analyze and implement solutions in a dynamic operations environment. Demonstrated ability to collaborate with cross-functional teams and prioritize multiple activities effectively.

Minimum Qualifications: Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 2+ years of relevant experience. Master’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 6+ months of relevant experience. Experience listed above should be in any the following: Semiconductor Equipment Development and/or Manufacturing Semiconductor Product Development and/or Manufacturing High Volume Technology Manufacturing Automated Manufacturing This position is not eligible for Intel Immigration Sponsorship Preferred Qualifications: - High Volume Manufacturing experience is a plus. - Engineering experience in Semiconductor Fab or Package Assembly is a plus. We invite you to bring your expertise, creativity, and passion for innovation to Intel, where you can make a meaningful impact on the future of technology. Apply today to join our team and help drive Intel's success in delivering world-class packaging solutions.            Job Type: Experienced Hire Shift: Shift 6