Director of Package Design

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering ( SCHIE ) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.   The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more.   As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.   We are looking for a Director of package design to join the team to support our mission as a key leader of the advanced packaging design team.   #SCHIE #CSME #SMPE Responsibilities Lead and mentor a team of talented package design engineers, supporting their career growth and professional development.  Drive optimal silicon packaging solution supporting Azure datacenter product roadmap. Drive package technology for chiplet architecture with advanced 2.5D/3D packaging. Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout Define, design and develop test vehicles to validate Silicon, Package, System performance. Drive supplier assessments and manage suppliers through definition, development, qualification and production. Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options. Define EDA tools requirements for advanced 3DIC packaging designs Design and develop package and assembly drawings to support the manufacturing. Lead supplier assessments and manage suppliers through definition, development, qualification and production. Assess and characterize the reliability of Integrated Circuits (IC) packages. Design and develop package and assembly drawings to support the manufacturing. Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers. Drive execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines. Drive engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

Required Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical