Etch Process Engineer E3S

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

Salary: $124,000.00 - $171,000.00 Location: Santa Clara,CA You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.  At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .

Design, execute, collect, analyze, and document routine to moderately complex plasma etch process experiments in compliance with safety guidelines. Support investigation of etch process challenges and contribute to developing experimental plans for process improvement activities (e.g., profile control, selectivity, CD, defectivity, uniformity). Perform etch chamber hardware and process characterization under the guidance of senior engineers, including evaluation of hardware components such as ESCs, rings, liners, gas delivery systems, and RF subsystems. Troubleshoot routine process issues, perform root cause analysis, and implement corrective actions with guidance from experienced engineers. Measure and analyze thin-film and post-etch material properties using standard metrology techniques and established methodologies. Translate engineering requirements into process experiments and support development of practical process solutions. Collaborate with hardware, mechanical, manufacturing, COE, and customer-facing teams to understand interactions between process conditions, chamber hardware, and device performance. Prepare technical reports, experiment summaries, presentations, and engineering documentation to communicate findings and recommendations. Support qualification and introduction of new etch processes, chamber hardware, materials, and recipes into development and production environments. Required Technical Skills & Knowledge Fundamental understanding of plasma etch processes, including plasma chemistry, surface interactions, and process parameter relationships. Working knowledge of etch chamber subsystems and key process controls, including RF power, gas delivery, pressure, temperature, and hardware configuration. Familiarity with thin-film materials and characterization techniques such as SEM, XRD, XPS, and post-etch analysis. Basic proficiency in Design of Experiments (DOE), statistical analysis, and process data interpretation. Ability to evaluate process data and identify relationships between hardware configuration, process performance, and wafer results. Strong problem-solving, analytical, and communication skills. Scope & Autonomy (E3s Level) Works under general supervision while performing routine to moderately complex engineering assignments. Executes established engineering procedures and contributes to process development activities. Escalates complex technical issues appropriately and seeks guidance when required. Supports project objectives and process development efforts within an assigned area of responsibility. Collaborates effectively with cross-functional teams to achieve engineering and business goals.

Master’s degree (or foreign