Assembler

Standard Job Description 
 Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement. Electrically troubleshoots hybrid circuitry using an ohmmeter. Performs final assembly operations including attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages. Performs thick film screen, dry, and fire operations of various types.   You will be the Microelectronic Bonder for Lockheed Martin Missiles & Fire Control in Chelmsford, MA. Our team is responsible for fabricating and modifying hybrid microcircuits and sub‑assemblies that support critical defense systems.

As the Microelectronic Bonder, you will be responsible for executing high‑precision wire‑bonding and hybrid circuit fabrication tasks.   Your responsibilities will include, but are not limited to: Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds, or chip placement.   Why Join Us   We offer a purpose‑driven environment where your expertise directly contributes to mission‑critical technology. You’ll work alongside skilled professionals and have access to a comprehensive benefits package. Further Information About This Opportunity   This position is in Chelmsford. Discover more about our Chelmsford, Massachusetts location. MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a Secret clearance. A company‑sponsored interim Secret clearance is required to start. Basic Qualifications 
 High school diploma or GED required. Ability to obtain and maintain a Secret security clearance, which requires U.S. citizenship Desired Skills 
 Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.  Familiarity with manual bonding equipment and with automatic bonding equipment. Basic computer skills required, including ability to navigate digital systems for timekeeping, work instructions, and task confirmation. Strong attention to detail and ability to work in a fast-paced environment. Ability to follow written and verbal instructions. Ability to learn J-STD-001 and/or IPC-A-610. Knowledge of ESD procedures and test equipment. Strong work ethic and a reputation for punctuality and reliability, with  a desire to grow and learn in their role. Pay Information Full-Time Salary Range: $47100.00 - $87500.00 At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally. The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.   Benefits offered: Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k)