Staff Engineer, RFFE Process and Device

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > ASICS Engineering General Summary: As a member of the Qualcomm Si Process Packaging Solutions (PPS) team, this candidate will drive Si process technology evaluation, development, design enablement and productization for Mixed-Signal/RF products at foundry partners.

Drive bulk Si and RFSOI technology evaluation, development and design enablement for RFFE designs, including RF switching and antenna circuits, receivers, transmitters. Work with Qualcomm design and product teams to define process and device requirements for continuous technology improvements. Define and execute test structures DOE, layout and characterization for process evaluation to meet design requirements. Design, simulate and test RF circuits to understand the process-design-layout interaction to guide process-design-layout optimization to achieve optimum performance. Interact with internal design teams, PDK teams, reliability, and product engineering to ensure technology support. Support Qualcomm design, layout, PTE and reliability teams to address their questions and resolve any device and design optimization issues. Assure product quality by devising testing methodology, and testing product and system capabilities. Work independently on assigned tasks with full ownership of technical execution and schedule commitments. Innovate new methods for continuous device and process improvement; support automation and AI-assisted workflows. Minimum Qualifications: • Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience. OR Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience. OR PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.

Minimum of 8+ years of industrial experience developing advanced CMOS processes and devices Excellent understanding of the RF-CMOS, SOI or BiCMOS, process integration, reliability, design rules and best layout practices. Excellent understanding of PDK related details including DRC, LVS, LPE, etc. Proficiency in device level test-structure development, DOE design, statistical analysis, and data-driven problem solving Excellent understanding of sub-micron process/device optimization and its impact on digital/analog/RF/HV circuit design and product level performance is required. Experience designing wafer level designs (analog IPs, LNA, PAs) and circuit design flows is plus. Good knowledge of RF (e.g. S-parameters, Harmonics, Noise Figure)  and DC characterization of devices on wafers, and in product ICs. Good knowledge of technology evaluation/benchmarking, SPC monitoring, and reliability qualification. Good understanding of BSIM, PSP-SOI device models and ability to run hardware correlations. Ability to tweak and update models is a plus. Fab device engineering or process integration experience preferably in RF devices is a plus. Foundry and OSAT interface experience is a plus. Good communication skills and demonstrated ability to meet deadlines and commitments. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  disability-accomodations@qualcomm.com  or call Qualcomm's toll-free number found  here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations