WPM C4 Quality and Reliability Engineer

Job Description: As a world's leading chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art. From semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly advanced die prep and packaging. Employees in Intel Foundry are part of a worldwide network of manufacturing, advanced packaging, and assembly/test facilities. As a Quality and Reliability Engineer (QRE), you will be part of FQRL (Foundry Quality, Reliability, and Labs), Intel's Quality and Reliability organization. We are strong believers in partnership, collaboration and teamwork. You will routinely work with the fab module engineers, process integration[RB1.1] and worldwide employees both internal and external to Intel. This is an on-site role that requires living in Oregon. This role requires evening meetings most work days. The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly. In addition to traditional product types, we drive Intel's advanced packaging strategy - bringing compelling capabilities to market and enabling large-scale AI computing. C4 (bumping) QREs cover several critical process segments[RB2.1] such as interposer, micro-logical, and package side bumping in the WPM organization. Your key deliverables will include: • Manage customer quality (both internal and external) issues on products. • Extract and Analyze data to support risk assessment of suspect/non-conforming material. • Support and engage with down-stream partners to manage excursions, down-stream investigations, and respond to issues. • Partnering with other organizations to proactively drive improvements in quality and reliability performance. • Ensure that the metrics and goals for the end-of-line-hold operations are met, as well as MRB (Material Review Board) [RB3.1]inventory. • Identify and drive activities and projects to improve detection and containment of potentially discrepant or unreliable material. • Support Certification and Ramp of new technologies from on-site and off-site development teams. • 24x7 on-call response (as part of an engineering rotation) to respond to urgent line issues, excursions, or to support task force-level projects. The ideal candidate should exhibit the following behavioral traits: • Strong communication and collaboration skills with the ability to work effectively across cross-functional teams. • Experience in manufacturing environments or familiarity with high-volume production processes. • A growth mindset and active interest in continuous learning and development. • Make technical decisions and provide technical direction. • Evidence of organizational and planning skills for engineering projects. • Demonstrate effective communication up and down the organization, including skills to communicate technical issues and status to factory and program leadership. • Effectively work in a highly networked, cross organization role. • Exhibit strong team building and influencing skills. • Work under pressure, and in an ever-changing and dynamic environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Master's degree in a specialized field such as Engineering, Science, or a related discipline At least 6 months of experience in the following: - Knowledge of manufacturing processes, semiconductor fabrication, and quality assessment methodologies. - Familiar with excursion management, reliability fundamentals, or problem-solving techniques. - Proficiency