Thin Films Module Development Engineer

Job Description: Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.

Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platforms Design, implement, and optimize processes to meet specifications for materials, device performance, yield, and process control Design, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvement Apply expert knowledge of equipment operating principles, materials characterization and metrology, and device characteristics to accelerate technology development learning cycles Support novel material and process screening and evaluation, equipment selection, on-time install/qualification of first-of-kind equipment, and design for manufacturability Partner with cross-functional teams including process integration, device engineering, metrology, yield, manufacturing, and equipment suppliers Contribute to process pathfinding efforts for next-generation semiconductor technologies through evaluation of novel materials, hardware assessment, process screening, integration development, and silicon validation Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field   With at least 1+ years of experience in: Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologies Demonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design   Preferred Qualifications: Experience in thin film metal deposition process development for high-k/metal gate stack, contact metallization, or Cu interconnect barrier/liner/plating Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test, defect inspection, reliability, and related techniques Experience with MOSFET / FinFET / GAA / CFET device characteristics, electrical characterization techniques, and semiconductor device fundamentals Proficient with data analysis software including JMP, Excel, Python, R, SQL Strong communication and collaboration skills with demonstrated ability to solve challenging and ambiguous technical problems in a fast-moving and dynamic team environment Experience using AI-assisted engineering tools to improve technical productivity while maintaining critical independent engineering judgement Strong written and verbal communication skills with ability to document decisions, summarize technical data, and align cross-functional stakeholders Availability to work on site and support 24/7 manufacturing operations with on-call rotation   For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information            Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race,