Senior Staff Advance Packaging Engineer

ADVANCE YOUR CAREER. ADVANCE THE WORLD.  At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.    Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

Help turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.   We are seeking a highly experienced Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, dynamic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability.   The successful candidate will play a key role in advancing AMD’s packaging methodologies by leveraging AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration and advanced packaging architectures.   THE PERSON:   The ideal candidate is an experienced package or silicon physical designer who: Demonstrates strong ownership and accountability across multiple programs Excels in fast-phase execution environments with competing priorities Applies AI/ML and automation to improve design productivity and quality Operates with minimal supervision while influencing cross-functional teams Balances deep technical expertise with strong collaboration and communication skills   KEY RESPONSIBILITIES:   Design Execution & Technical Leadership Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met Handle multiple concurrent design programs in a fast-paced and high-pressure environment Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures) Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams    Cross-Functional Collaboration Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions Interface with stakeholders to communicate design status, risks, and mitigation strategies Contribute to design reviews, signoff readiness, and tapeout processes   Methodology & Continuous Improvement Define and enhance package design methodologies, flows, and best practices Drive improvements in layout efficiency, reuse, and design standardization Mentor junior engineers and promote engineering excellence across the team   PREFERRED EXPERIENCE:   Experience in designing complex substrate design or Silicon Bridge or Interposers Proven ability to execute in multi-project, fast-phased, and high-pressure environments Strong experience in advanced packaging technologies: Hands-on experience with EDA tools such as: Experience working with OSATs, foundries, and substrate vendors Solid understanding of Signal Integrity and Power Integrity fundamentals   ACADEMIC CREDENTIALS:   Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field   LOCATION: Singapore   #LI-MD1 Benefits offered are described:  AMD benefits at a glance .   AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex,