ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community.   We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing.   The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron’s global network.

Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.  Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.    Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications.  Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).  Perform risk assessments Failure Mode & Effect Analysis (FMEA) and implement effective control plans and corrective actions for abnormal conditions.  Enable smooth technology transfer from development to high‑volume manufacturing.  Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Minimum Required Qualifications Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline. Minimum 2 years of experience in semiconductor related field Experience required in fan-in packaging process/advanced packaging technology Experience using SPC, DOE & JMP Operations support, including shift and weekend coverage, is required.  Strong analytical, logical, and critical thinking skills  Effective communicator, able to collaborate across all levels  Growth mindset with a passion for continuous learning  Internship or experience in the semiconductor industry is a plus  Demonstrated leadership and a track record of impact are highly desirable  Interest in and knowledge of the semiconductor industry and Micron is preferred  Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes. Embody Micron’s core values: People – Respect, develop, and empower others Innovation – Drive continuous improvement and breakthrough thinking Tenacity – Show grit and determination Collaboration – Build trust and foster teamwork Customer Focus – Deliver excellence and value Speed - Act with purpose and set the pace Must‑Have Soft Skills  Use AI -enabled tool responsibly and optimally for